 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| BSS138LT1 Preferred Device Power MOSFET 200 mA, 50 V N-Channel SOT-23 Typical applications are DC-DC converters, power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. Features http://onsemi.com * Pb-Free Packages are Available * Low Threshold Voltage (VGS(th): 0.5 V-1.5 V) Makes it Ideal for * Low Voltage Applications Miniature SOT-23 Surface Mount Package Saves Board Space 200 mA, 50 V RDS(on) = 3.5 W N-Channel 3 1 MAXIMUM RATINGS (TA = 25C unless otherwise noted) Rating Drain-to-Source Voltage Gate-to-Source Voltage - Continuous Drain Current - Continuous @ TA = 25C - Pulsed Drain Current (tp 10 ms) Total Power Dissipation @ TA = 25C Operating and Storage Temperature Range Thermal Resistance - Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes, for 10 seconds Symbol VDSS VGS ID IDM PD TJ, Tstg RqJA TL Value 50 20 200 800 225 - 55 to 150 556 260 mW C C/W C J1 M = Device Code = Date Code 1 Unit Vdc Vdc mA 1 2 3 2 SOT-23 CASE 318 STYLE 21 MARKING DIAGRAM & PIN ASSIGNMENT 3 Drain J1M Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 2 Gate Source ORDERING INFORMATION Device BSS138LT1 BSS138LT1G BSS138LT3 BSS138LT3G Package SOT-23 SOT-23 (Pb-Free) SOT-23 SOT-23 (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel 10,000 Tape & Reel 10,000 Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2004 1 June, 2004 - Rev. 3 Publication Order Number: BSS138LT1/D BSS138LT1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 mAdc) Zero Gate Voltage Drain Current (VDS = 25 Vdc, VGS = 0 Vdc) (VDS = 50 Vdc, VGS = 0 Vdc) Gate-Source Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc) ON CHARACTERISTICS (Note 1) Gate-Source Threshold Voltage (VDS = VGS, ID = 1.0 mAdc) Static Drain-to-Source On-Resistance (VGS = 2.75 Vdc, ID < 200 mAdc, TA = -40C to +85C) (VGS = 5.0 Vdc, ID = 200 mAdc) Forward Transconductance (VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance (VDS = 25 Vdc, VGS = 0, f = 1 MHz) (VDS = 25 Vdc, VGS = 0, f = 1 MHz) (VDG = 25 Vdc, VGS = 0, f = 1 MHz) Ciss Coss Crss - - - 40 12 3.5 50 25 5.0 pF VGS(th) rDS(on) - - gfs 100 5.6 - - 10 3.5 - mmhos 0.5 - 1.5 Vdc Ohms V(BR)DSS IDSS - - IGSS - - - - 0.1 0.5 0.1 mAdc 50 - - Vdc mAdc Symbol Min Typ Max Unit SWITCHING CHARACTERISTICS (Note 2) Turn-On Delay Time Turn-Off Delay Time (VDD = 30 Vdc, ID = 0.2 Adc,) Vdc 0 2 Adc ) td(on) td(off) - - - - 20 20 ns 1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature. http://onsemi.com 2 BSS138LT1 TYPICAL ELECTRICAL CHARACTERISTICS 0.8 0.7 I D , DRAIN CURRENT (AMPS) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 6 7 8 9 10 0.9 0.8 I D , DRAIN CURRENT (AMPS) VGS = 3.25 V VGS = 3.0 V VGS = 2.75 V VGS = 2.5 V 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 TJ = 25C VGS = 3.5 V VDS = 10 V - 55C 25C 150C VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) Figure 1. On-Region Characteristics 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 -55 -5 45 95 145 0.75 -55 -30 VGS = 4.5 V ID = 0.5 A VGS = 10 V ID = 0.8 A 1.25 Figure 2. Transfer Characteristics RDS(on) , DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) ID = 1.0 mA Vgs(th) , VARIANCE (VOLTS) 1.125 1 0.875 -5 20 45 70 95 120 145 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 3. On-Resistance Variation with Temperature VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) 10 8 6 4 ID = 200 mA 2 0 VDS = 40 V TJ = 25C Figure 4. Threshold Voltage Variation with Temperature 0 500 1000 1500 2000 2500 3000 QT, TOTAL GATE CHARGE (pC) Figure 5. Gate Charge http://onsemi.com 3 BSS138LT1 TYPICAL ELECTRICAL CHARACTERISTICS RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) 10 9 8 7 6 5 4 3 2 1 0 0.05 0.1 0.15 0.2 0.25 -55C 25C 8 7 6 5 4 3 2 1 0 0.05 0.1 0.15 0.2 25C -55C 0.25 VGS = 2.5 V VGS = 2.75 V 150C 150C ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS) Figure 6. On-Resistance versus Drain Current RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) 6 5.5 5 4.5 4 3.5 3 2.5 2 1.5 1 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 -55C 25C 4.5 4 3.5 3 2.5 2 1.5 1 Figure 7. On-Resistance versus Drain Current VGS = 4.5 V 150C VGS = 10 V 150C 25C -55C 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS) Figure 8. On-Resistance versus Drain Current Figure 9. On-Resistance versus Drain Current 1 I D , DIODE CURRENT (AMPS) 120 100 0.1 TJ = 150C 25C -55C 80 60 0.01 Ciss 40 20 Coss Crss 0 5 10 15 20 25 0.001 0 0.2 0.4 0.6 0.8 1.0 1.2 0 VSD, DIODE FORWARD VOLTAGE (VOLTS) Figure 10. Body Diode Forward Voltage Figure 11. Capacitance http://onsemi.com 4 BSS138LT1 PACKAGE DIMENSIONS SOT-23 (TO-236) CASE 318-08 ISSUE AH A L 3 1 2 BS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318-03 AND -07 OBSOLETE, NEW STANDARD 318-08. DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 V G C D H K J STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 BSS138LT1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 BSS138LT1/D |
Price & Availability of BSS138LT1
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |